lead-free parts pb led array ligitek electronics co.,ltd. property of ligitek only data sheet a la299b/srg-pf - 2008 02 - sep. doc. no : qw0905- rev. : date : la299b/srg-pf
1/6 page package dimensions la299b/srg-pf part no. ligitek electronics co.,ltd. property of ligitek only note : 1.all dimension are in millimeter tolerance is ? 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. 1.cathode green 2.common anode 3.cathode red 18.0min 2.0min 2.0typ 2.0min 2.0typ - + - 5.2 1.5 max ? ? 0.5 sr 5.0 2.4? 0.3 3.0 23 1 2.54typ - + - 3.9 ? 0.5 2.54typ 7.0 7.3 ?? 0.5 typ 23 1 3.cathode green 1.cathode re d 2.common anode lsrg42292/r6/h-pf 4.2 6.70.5
-40 ~ +85 operating temperature t opr viewing angle 2 1/2 (deg) peak wave length pnm la299b/srg-pf note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. 565 gapgreen red emitted gaalas white diffused 660 lens 2.6 1.7286560 30 max. 201.52.4 min. 60 50120 typ. min. typical electrical & optical characteristics (ta=25 ) material part no color forward voltage @20ma(v) spectral halfwidth nm luminous intensity @20ma(mcd) storage temperature tstg -40 ~ +100 2/6 page 15 ma 30 forward current i f reverse current @5v ir peak forward current duty 1/10@10khz power dissipation pd i fp 10 a 10050 10080 mw ma absolute maximum ratings at ta=25 parameter symbol g sr ratings unit ligitek electronics co.,ltd. property of ligitek only la299b/srg-pf part no.
fig.4 relative intensity vs. temperature 1.0 r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) 600 0.0 0.5 650700750 ambient temperature( ) fig.5 relative intensity vs. wavelength fig.3 forward voltage vs. temperature f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 -40 0.8 -20 1.0 0.9 1.1 1.2 0.5 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 80 40 20 060100 0.0 2.5 1.5 1.0 2.0 3.0 ambient temperature( ) -40-2002060 40100 80 3.0 2.5 2.0 1.5 1.0 0.5 0.0 ligitek electronics co.,ltd. property of ligitek only fig.2 relative intensity vs. forward current typical electro-optical characteristics curve 2.0 fig.1 forward current vs. forward voltage forward voltage(v) 100 f o r w a r d c u r r e n t ( m a ) 1.0 0.1 10 1.0 sr chip 1000 r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a 3.04.05.0 3/6 page forward current(ma) 1.0101001000 la299b/srg-pf part no.
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) page forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 g chip fig.6 directive radiation 4/6 la299b/srg-pf part no.
60 seconds max 0 preheat 0 25 2 /sec max 100 50 150 time(sec) temp( c) 120 260 5 /sec max 260 c3sec max dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time) distance:2mm min(from solder joint to body) ligitek electronics co.,ltd. property of ligitek only page 5/6 la299b/srg-pf part no. note: 1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above.
reference standard page 6/6 description the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. test condition test item 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 ligitek electronics co.,ltd. property of ligitek only mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 high temperature storage test low temperature storage test reliability test: operating life test the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to see soldering well performed or not. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.t.sol=230 5 2.dwell time=5 1sec 1.t.sol=260 5 2.dwell time= 10 1sec. mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202:103b jis c 7021: b-11 solderability test high temperature high humidity test solder resistance test thermal shock test la299b/srg-pf part no.
|
